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SKYPERTM 32 - Technical Explanations
SKYPERTM 32
Technical Explanations
Revision 04 Status: preliminary
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------This Technical Explanation is valid for the following parts: part number L6100100 Related documents: title Data Sheet SKYPERTM 32 Prepared by: Markus Hermwille -------------------------------------------------------------------------------------------------------------------------------------------------------------------------version 03-06-2005 SKYPERTM 32 type date code (YYWW) 0519
Content Application and Handling Instructions...................................................................................................................... 2 Further application support ...................................................................................................................................... 2 General Description................................................................................................................................................. 2 Features of SKYPERTM 32 ...................................................................................................................................... 2 Block diagram.......................................................................................................................................................... 3 Dimensions.............................................................................................................................................................. 3 PIN Array - Primary Side......................................................................................................................................... 4 PIN Array - Secondary Side.................................................................................................................................... 5 Driver Performance ................................................................................................................................................. 6 Insulation ................................................................................................................................................................. 6 Auxiliary Power Supply ............................................................................................................................................ 6 Under Voltage Protection of driver power supply (UVP).......................................................................................... 7 Input Signals............................................................................................................................................................ 8 Short Pulse Suppression (SPS)............................................................................................................................... 8 Failure Management................................................................................................................................................ 8 Shut Down Input (SDI)............................................................................................................................................. 9 Dead Time generation (Interlock TOP / BOT) (DT) ................................................................................................. 9 Dynamic Short Circuit Protection by VCEsat monitoring / de-saturation monitoring (DSCP).................................... 10 Adjustment of DSCP.............................................................................................................................................. 11 High Voltage Diode for DSCP................................................................................................................................ 12 Gate resistors ........................................................................................................................................................ 12 External Boost Capacitors (BC)............................................................................................................................. 13 Application Example .............................................................................................................................................. 13 Mounting Notes ..................................................................................................................................................... 14 Marking.................................................................................................................................................................. 15
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed with respect to the accuracy or use of such information. Furthermore, this technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. Specifications mentioned in this document are subject to change without notice. This document supersedes and replaces all information previously supplied and may be supersede by updates.
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SKYPERTM 32 - Technical Explanations
Please note: All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating parameters should be validated by user's technical experts for each application.
Application and Handling Instructions Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules. Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-snubbers between main terminals for PLUS and MINUS of the power module. When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector voltage. It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device. The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below -0,3V may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided. The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the driver leads should be twisted.
Further application support Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON Application Manual Power Modules available at http://www.semikron.com.
General Description The SKYPERTM 32 core constitutes an interface between IGBT modules and the controller. This core is a half bridge driver. Basic functions for driving, potential separation and protection are integrated in the driver. Thus it can be used to build up a driver solution for IGBT modules. Features of SKYPERTM 32 Two output channels Integrated potential free power supply for the secondary side Short Pulse Suppression (SPS) Under Voltage Protection (UVP) Drive interlock (dead time) top / bottom (DT) Dynamic Short Circuit Protection (DSCP) by VCE monitoring and direct switch off Shut Down Input (SDI) Failure Management Expandable by External Boost Capacitors (BC) DC bus voltage up to 1200V
SKYPERTM 32
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SKYPERTM 32 - Technical Explanations
Block diagram
Block diagram
Dimensions
Dimensions in mm
10,3
10,3
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SKYPERTM 32 - Technical Explanations
PIN Array - Primary Side
Connectors Connector X10 (RM2,54, 10pin)
PIN X10:01 X10:02
Signal PRIM_PWR_GND PRIM_PWR_GND
Function GND for power supply and GND for digital signals GND for power supply and GND for digital signals ERROR output ERROR input GND for power supply and GND for digital signals GND for power supply and GND for digital signals Switching signal input (TOP switch)
Specification
X10:03 X10:04 X10:05 X10:06
PRIM_nERROR_OUT PRIM_nERROR_IN PRIM_PWR_GND PRIM_PWR_GND
LOW = NO ERROR; open collector output; max. 30V / 15mA (external pull up resistor necessary) 5V logic; LOW active
X10:07
PRIM_TOP_IN
Digital 15 V; 10 kOhm impedance; LOW = TOP switch off; HIGH = TOP switch on Digital 15 V; 10 kOhm impedance; LOW = BOT switch off; HIGH = BOT switch on Stabilised +15V 4% Stabilised +15V 4%
X10:08 X10:09 X10:10
PRIM_BOT_IN PRIM_PWR_15P PRIM_PWR_15P
Switching signal input (BOTTOM switch) Drive core power supply Drive core power supply
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SKYPERTM 32 - Technical Explanations
PIN Array - Secondary Side
Connectors Connector X100 / X200 (RM2,54, 10pin)
PIN X100:01 X100:02 X100:03 X100:04 X100:05 X100:06 X100:07 X100:08 X100:09 X100:10 X200:01 X200:02 X200:03 X200:04 X200:05 X200:06 X200:07 X200:08 X200:09 X200:10
Signal SEC_TOP_VCE_CFG SEC_TOP_VCE_IN SEC_TOP_15P SEC_TOP_15P SEC_TOP_GND SEC_TOP_IGBT_ON SEC_TOP_GND SEC_TOP_IGBT_OFF SEC_TOP_8N SEC_TOP_8N SEC_BOT_VCE_CFG SEC_BOT_VCE_IN SEC_BOT_15P SEC_BOT_15P SEC_BOT_GND SEC_BOT_IGBT_ON SEC_BOT_GND SEC_BOT_IGBT_OFF SEC_BOT_8N SEC_BOT_8N
Function Input reference voltage adjustment Input VCE monitoring Output power supply for external buffer capacitors Output power supply for external buffer capacitors GND for power supply and GND for digital signals Switch on signal TOP IGBT GND for power supply and GND for digital signals Switch off signal TOP IGBT Output power supply for external buffer capacitors Output power supply for external buffer capacitors Input reference voltage adjustment Input VCE monitoring Output power supply for external buffer capacitors Output power supply for external buffer capacitors GND for power supply and GND for digital signals Switch on signal BOT IGBT GND for power supply and GND for digital signals Switch off signal BOT IGBT Output power supply for external buffer capacitors Output power supply for external buffer capacitors
Specification
Stabilised +15V Stabilised +15V
Stabilised -7V Stabilised -7V
Stabilised +15V Stabilised +15V
Stabilised -7V Stabilised -7V
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SKYPERTM 32 - Technical Explanations
Driver Performance The driver is designed for application with half bridges or single modules and a maximum gate charge per pulse < 2,5C (< 6,3C with external boost capacitors). The charge necessary to switch the IGBT is mainly depending on the IGBT's chip size, the DC-link voltage and the gate voltage. This correlation is shown in module datasheets. It should, however, be considered that the driver is turned on at +15V and turned off at -7V. Therefore, the gate voltage will change by 22V during each switching procedure. Unfortunately, many datasheets do not show negative gate voltages. In order to determine the required charge, the upper leg of the charge curve may be prolonged to +22V for determination of approximate charge per switch. The medium output current of the driver is determined by the switching frequency and the gate charge. The maximum switching frequency may be calculated with the shown equations.
Calculation Switching Frequency Maximum Switching Frequency @ different Gate Charges @ Tamb=25C
60 kHz
fmax
switching frequency
Iout AV max = QGE
50 kHz
40 kHz
30 kHz
fmax: QGE:
Maximum switching frequency Gate charge of the driven IGBT
IoutAVmax: Maximum output average current
20 kHz
10 kHz
with external boost capacitors
0 kHz 0 C
1 C
2 C
3 C 4 C gate charge
5 C
6 C
7 C
Please note: The maximum value of the switching frequency is limited to 50kHz due to switching reasons.
Insulation Magnetic transformers are used for insulation between gate driver primary and secondary side. The transformer set consists of pulse transformers which are used bidirectional for turn-on and turn-off signals of the IGBT and the error feedback between secondary and primary side, and a DC/DC converter. This converter provides a potential separation (galvanic separation) and power supply for the two secondary (TOP and BOT) sides of the driver. Thus, external transformers for external power supply are not required.
Creepage and Clearance Distance in mm Primary to secondary Min. 12,2
Auxiliary Power Supply A few basic rules should be followed when dimensioning the customer side power supply for the driver. The following table shows the required features of an appropriate power supply.
Requirements of the auxiliary power supply Regulated power supply Maximum rise time of auxiliary power supply Minimum peak current of auxiliary supply Power on reset completed after +15V 4% 50ms 1A 150ms Please note: Do not apply switching signals during power on reset.
The supplying switched mode power supply may not be turned-off for a short time as consequence of its current limitation. Its output characteristic needs to be considered. Switched mode power supplies with fold-back
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SKYPERTM 32 - Technical Explanations
characteristic or hiccup-mode can create problems if no sufficient over current margin is available. The voltage has to rise continuously and without any plateau formation as shown in the following diagram.
Rising slope of the power supply voltage
If the power supply is able to provide a higher current, a peak current will flow in the first instant to charge up the input capacitances on the driver. Its peak current value will be limited by the power supply and the effective impedances (e.g. distribution lines), only. It is recommended to avoid the paralleling of several customer side power supply units. Their different set current limitations may lead to dips in the supply voltage. The driver is ready for operation typically 150ms after turning on the supply voltage. The driver error signal PRIM_nERROR_OUT is operational after this time. Without any error present, the error signal will be reset. To assure a high level of system safety the TOP and BOT signal inputs should stay in a defined state (OFF state, LOW) during driver turn-on time. Only after the end of the power-on-reset, IGBT switching operation shall be permitted.
Under Voltage Protection of driver power supply (UVP) The internally detected supply voltage of the driver has an under voltage protection. The table below gives an overview of the trip level.
Supply voltage Regulated +15V 4% UVP level 13,5V
If the internally detected supply voltage of the driver falls below this level, the IGBTs will be switched off (IGBT driving signals set to LOW). The input side switching signals of the driver will be ignored. The error memory will be set, and the output PRIM_nERROR_OUT changes to the HIGH state.
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SKYPERTM 32 - Technical Explanations
Input Signals The signal transfer to each IGBT is made with pulse transformers, used for switching on and switching off of the IGBT. The inputs have a Schmitt Trigger characteristic and a positive / active high logic (input HIGH = IGBT on; input LOW = IGBT off). It is mandatory to use circuits which switch active to +15V and 0V. Pull up and open collector output stages must not be used for TOP / BOT control signals. It is recommended choosing the line drivers according to the demanded length of the signal lines.
Please note: It is not permitted to apply switching pulses shorter than 1s.
TOP / BOT Input A capacitor is connected to the input to obtain high noise immunity. This capacitor can cause for current limited line drivers a little delay of few ns, which can be neglected. The capacitors have to be placed as close as possible to the driver interface.
Short Pulse Suppression (SPS) This circuit suppresses short turn-on and off-pulses of incoming signals. This way the IGBTs are protected against spurious noise as they can occur due to bursts on the signal lines. Pulses shorter than 625ns are suppressed and all pulses longer than 750ns get through for 100% probability. Pulses with a length in-between 625ns and 750ns can be either suppressed or get through.
Pulse pattern - SPS
Failure Management Any error detected will set the error latch and force the output PRIM_nERROR_OUT into HIGH state. Switching pulses from the controller will be ignored. A reset of the latched error memory is only possible if no failure is present anymore and if the TOP and BOT input signals are set to the LOW level for a period of tpERRRESET > 9s. The output PRIM_nERROR_OUT is an open collector output. For the error evaluation an external pull-up-resistor is necessary pulled-up to the positive operation voltage of the control logic (LOW signal = no error present, wire break safety is assured).
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SKYPERTM 32 - Technical Explanations
Open collector error transistor Application hints An external resistor to the controller logic high level is required. The resistor has to be in the range of V / Imax < Rpull_up < 10k. PRIM_nERROR_OUT can operate to maximum 30V and can switch a maximum of 15mA. Example: For V = +15V the needed resistor should be in the range Rpull_up = (15V/15mA) ... 10k 1k... 10k.
Please note: The error output PRIM_ERROR_OUT is not short circuit proof.
Shut Down Input (SDI) The shut down input / error input signal can gather error signals of other hardware components for switching off the IGBT (input HIGH = no turn-off; input LOW = turn-off). A LOW signal at PRIM_nERROR_IN will set the error latch and force the output PRIM_nERROR_OUT into HIGH state. Switching pulses from the controller will be ignored. A reset of the latched error memory is only possible if no LOW signal at PRIM_nERROR_IN is present anymore and if the TOP and BOT input signals are set to the LOW level for a period of tpERRRESET > 9s. The SDI function can be disabled by no connection or connecting to 5V.
Connection SDI
Dead Time generation (Interlock TOP / BOT) (DT) The DT circuit prevents, that TOP and BOT IGBT of one half bridge are switched on at the same time (shoot through). The dead time is not added to a dead time given by the controller. Thus the total dead time is the maximum of "built in dead time" and "controller dead time". It is possible to control the driver with one switching signal and its inverted signal.
Please note: The generated dead time is fixed and cannot be changed.
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SKYPERTM 32 - Technical Explanations
Pulse pattern - DT The total propagation delay of the driver is the sum of interlock dead time (tTD) and driver input output signal propagation delay (td(on;off)IO) as shown in the pulse pattern. Moreover the switching time of the IGBT chip has to be taken into account (not shown in the pulse pattern). In case both channel inputs (PRIM_TOP_IN and PRIM_BOT_IN) are at high level, the IGBTs will be turned off. If only one channel is switching, there will be no interlock dead time.
Please note: No error message will be generated when overlap of switching signals occurs.
Dynamic Short Circuit Protection by VCEsat monitoring / de-saturation monitoring (DSCP) The DSCP circuit monitors the collector-emitter voltage VCE of the IGBT during its on-state. VCE is internally limited to 10V. If the reference voltage VCEref is exceeded, the IGBT will be switched off and an error is indicated. The reference voltage VCEref may dynamically be adapted to the IGBTs switching behaviour. Immediately after turn-on of the IGBT, a higher value is effective than in steady state. This value will, however, be reset, when the IGBT is turned off. VCEstat is the steady-state value of VCEref and is adjusted to the required maximum value for each IGBT by an external resistor RCE. It may not exceed 10V. The time constant for the delay of VCEref may be increased by an external capacitor CCE, which is connected in parallel to RCE. It controls the blanking time tbl which passes after turn-on of the IGBT before the VCEsat monitoring is activated. This makes an adaptation to any IGBT switching behaviour possible.
Dynamic saturation voltage characteristic of an IGBT and possible protection level
After tbl has passed, the VCE monitoring will be triggered as soon as VCEsat > VCEref and will turn off the IGBT. The error memory will be set, and the output PRIM_nERROR_OUT changes to the HIGH state. Possible failure modes are shows in the following pictures.
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SKYPERTM 32 - Technical Explanations
Short circuit during operation
Turn on of IGBT too slow *
Short circuit during turn on
* or adjusted blanking time too short
Adjustment of DSCP The external components RCE and CCE are applied for adjusting the steady-state threshold and the short circuit monitoring dynamic as well as the blanking time.
Connection RCE and CCE Dimensioning of RCE and CCE RCE for < 1200V IGBT:
10 x VCEstat + 14 8,6 - VCEstat
R CE (k ) =
RCE for 1700V IGBT :
R CE (k ) =
10 x VCEstat + 18 8,2 - VCEstat
CCE:
C CE (nF ) =
t bl 15 - VCEstat ( V ) 10 x R CE (k) x ln 10 + R CE (k ) 10 - VCEstat ( V )
Recommended values: 10k < RCE < 100k CCE < 2,7nF 1200V IGBT: RCE=18k, CCE=330pF 1700V IGBT: RCE=36k, CCE=470pF
Application hints If the DSCP function is not used, for example during the experimental phase, SEC_TOP_VCE_IN must be connected with SEC_TOP_GND for disabling SCP @ TOP side and SEC_BOT_VCE_IN must be connected with SEC_BOT_GND for disabling SCP @ BOT side.
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SKYPERTM 32 - Technical Explanations
High Voltage Diode for DSCP The high voltage diode blocks the high voltage during IGBT off state. The connection of this diode between driver and IGBT is shows in the following schematic.
Connection High Voltage Diode Characteristics Reverse blocking voltage of the diode shall be higher than the used IGBT. Reverse recovery time of the fast diode shall be lower than VCE rising of the used IGBT. Forward voltage of the diode: 1,5V @ 2mA forward current (Tj=25C). A collector series resistance RVCE (1k / 0,4W) must be connected for 1700V IGBT operation.
Gate resistors The output transistors of the driver are MOSFETs. The sources of the MOSFETs are separately connected to external terminals in order to provide setting of the turn-on and turn-off speed of each IGBT by the external resistors RGon and RGoff. As an IGBT has input capacitance (varying during switching time) which must be charged and discharged, both resistors will dictate what time must be taken to do this. The final value of the resistance is difficult to predict, because it depends on many parameters as DC link voltage, stray inductance of the circuit, switching frequency and type of IGBT.
Connection RGon, RGoff Application Hints The gate resistor influences the switching time, switching losses, dv/dt behaviour, etc. and has to be selected very carefully. Due to this influence a general value for the gate resistors cannot be recommended. The gate resistor has to be optimized according to switching behaviour and over voltage peaks within the specific circuitry. By increasing RGon the turn-on speed will decrease. The reverse peak current of the free-wheeling diode will diminish. By increasing RGoff the turn-off speed of the IGBT will decrease. The inductive peak over voltage during turn-off will diminish. In order to ensure locking of the IGBT even when the driver supply voltage is turned off, a resistance (RGE) has to be integrated.
Please note: Do not connect the terminals SEC_TOP_IGBT_ON with SEC_TOP_IGBT_OFF and SEC_BOT_IGBT_ON with SEC_BOT_IGBT_OFF, respectively.
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SKYPERTM 32 - Technical Explanations
External Boost Capacitors (BC) The rated gate charge of the driver may be increase by additional boost capacitors to drive IGBT with large gate capacitance.
Connection External Boost Capacitors
User Side
SEC_TOP_PWR_15P SEC_TOP_PWR_15P
Dimensioning of Cboost Cboost15P = QGE x 1/V - 2,2F Cboost8N = QGE x 2/V - 4,7F QGE: Gate charge of the IGBT @ VGE = -7 ...+15V Minimum rated voltage Cboost15P: 25V
SEC_TOP_PWR_8N SEC_TOP_PWR_8N Cboost8N SEC_TOP_GND SEC_TOP_GND Cboost15P
Minimum rated voltage Cboost8N: 16V Type of capacitor: ceramic capacitor Please consider the maximum rating four output charge per pulse of the gate driver. Application Hints
Cboost8N Cboost15P
SEC_BOT_PWR_15P SEC_BOT_PWR_15P
SEC_BOT_PWR_8N SEC_BOT_PWR_8N SEC_BOT_GND SEC_BOT_GND
The external boost capacitors should be connected as close as possible to the gate driver and to have low inductance.
Application Example
Connection Schematic
DC+
SKYPERTM 32
SEC_TOP_VCE_CFG SEC_TOP_VCE_IN SEC_TOP_15P SEC_TOP_15P SEC_TOP_GND SEC_TOP_IGBT_ON
BY203/20S 330pF 50V
18k
Ron
4,75k
PRIM_PWR_GND SEC_TOP_GND PRIM_PWR_GND SEC_TOP_IGBT_OFF PRIM_nERROR_OUT SEC_TOP_8N PRIM_nERROR_IN SEC_TOP_8N PRIM_PWR_GND PRIM_PWR_GND SEC_BOT_VCE_CFG
ERROR OUT
Roff 4,7F 16V 2,2F 25V
10k
INPUT TOP INPUT BOT
PRIM_TOP_IN SEC_BOT_VCE_IN PRIM_BOT_IN SEC_BOT_15P PRIM_PWR_15P SEC_BOT_15P
BY203/20S 330pF 50V
load
18k
+15V 1nF 100V 1nF 100V 1nF 100V 1nF 100V 220F 35V
PRIM_PWR_15P SEC_BOT_GND
Ron
SEC_BOT_IGBT_ON SEC_BOT_GND SEC_BOT_IGBT_OFF
Roff
SEC_BOT_8N SEC_BOT_8N
10k
4,7F 16V
2,2F 25V DC-
-
application example for 1200V IGBT Qout/pulse = 5C VCEref = 5V tbl = 1,5s
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SKYPERTM 32 - Technical Explanations
Mounting Notes
Soldering Hints The temperature of the solder must not exceed 260C, and solder time must not exceed 10 seconds. The ambient temperature must not exceed the specified maximum storage temperature of the driver. The solder joints should be in accordance to IPC A 610 Revision D (or later) Class 3 (Acceptability of Electronic Assemblies) to ensure an optimal connection between driver core and printed circuit board. Drill Hole & Pad Size in mm
Please note: The driver is not suited for hot air reflow or infrared reflow processes.
The connection between driver core and printed circuit board should be mechanical reinforced by using support posts.
Use of Support Posts Product information of suitable support posts and distributor contact information is available at e.g. http://www.richco-inc.com (e.g. series MSPM).
Please note: The use of agressive materials in cleaning and potting process of driver core may be detrimental for the device parameters. If the driver core is coated by the user, any warranty expires.
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SKYPERTM 32 - Technical Explanations
Marking Every driver core is marked. The marking contains the following items.
Part Marking Information The Data Matrix Code is described as follows: Type: Standard: Cell size: Dimension: EEC 200 ICO / IEC 16022 0,254 - 0,3 mm 5 x 5 mm
The following data is coded: XXXXXXXXYY 1. SEMIKRON part number (8 digits) + version number (2 digits) 2. Date code (4 digits): YYWW 3. Continuous number referred to date coce (4 digits) 4. Data matrix code 8 digits 2 digits 1 digit 4 digits 1 digit 4 digits ZZZZ VVVV
part number version number blank date code blank continuous number
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